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DAILY NEWS AND INFORMATION
FOR THE GLOBAL GRID COMMUNITY /
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Breaking News -
Networking:
Aeluros Assembles Broad XFP
Interoperability Verification
Aeluros announced that it has successfully demonstrated interoperability
between the Aeluros Puma AEL1002 IC and XFP module solutions from the
following leading XFP vendors: Agilent Technologies, Bookham Technology,
Finisar, Hitachi Cable, Intel, JDS Uniphase, Opnext, Picolight, Sumitomo
Electric and Tyco Electronics. This wide breadth of available XFP products
demonstrates the expanding availability of XFP-compliant solutions, and
indicates the growing maturity of the XFP-based 10 Gbps market. The completion
of these error-free interoperability verifications illustrates the viability
of the low-power, 800-mW Aeluros 10 Gbps Puma IC in addressing implementation
of 10 Gbps systems using the XFP form factor. With the removal of this barrier
from system design challenges, equipment manufacturers can direct scarce
resources to adding value at a system level, rather than expending energy
validating the interaction between their XFP module and physical layer IC.
The XFP form factor, defined by the XFP Multi-Source Agreement (MSA),
provides
a multi-sourced, application-agnostic, ultra-small form factor 10 Gbps optical
module solution that occupies as little as one-fifth the space and one-half
the power of alternative modules. These advantages drive a cost structure that
will allow rapid reductions in 10 Gigabit system price per port and will help
drive accelerated deployment of 10 Gigabit Ethernet, 10 Gigabit Fibre Channel,
and SONET/SDH systems. The 10 Gbps serial XFI standard, defined as the
electrical interface to the module, has also been leveraged by the Optical
Internetworking Forum (OIF) as part of the Common Electrical Interface (CEI)
project. The CEI effort will help drive the adoption of compatible signaling
into a wide variety of new chip-to-chip and backplane applications including
SerDes Framer Interfaces, System Packet Interfaces (SPIs), and TDM Fabric to
Framer Interfaces.
"Validation of multi-vendor interoperability is a crucial step in adoption
of
emerging industry standards," said David Gamba, director of marketing at
Aeluros. "By demonstrating the combined solution of the 800-mW Aeluros Puma
AEL1002 XFI-to-XAUI device with these leading XFP modules, we can together
provide this combination as a robust solution to our mutual customers."
"The excellent performance of Agilent's XFP fiber optic transceiver in
combination with the Puma SerDes from Aeluros clearly demonstrates a leading
edge XFP solution," said Antony Spilman, strategic marketing manager for
Agilent's Fiber Optic Products Division. "Our collaboration with Aeluros shows
how quickly 10 Gigabit technology has matured and proves the compactness,
robustness and low power operation that can be achieved with Agilent's XFP
optics."
"By transferring the SerDes function to the line card, the XFP module form
factor requires a volume only one-fifth the size of alternative 10 Gbps
modules," said Steve Joiner, director of marketing for Transceivers at
Bookham. "Implementation of XFP modules using Bookham's exclusive IO-PKG
optical packaging platform will enable the rapid propagation of low-cost,
small form factor modules for a wide range of distances. This puts a greater
degree of modularity into the hands of carriers, who thereby enjoy reduced
operating expenses, as well as lower capital costs."
"The XFP MSA defines the smallest and lowest-power 10 Gbps optical
transceiver
in the industry, enabling the highest density and lowest total cost
implementation for systems designers," said Christian Urricariet, director of
marketing for high-speed optics at Finisar. "By implementing Aeluros' Puma IC
with either Finisar's existing 10km XFP transceivers or our extended-reach
products under development, these benefits can be more fully realized."
"The use of a standardized interoperability platform in the Aeluros Puma
AEL1002 evaluation kit provides a board design solution that can be directly
leveraged for XFP system design," said Louis Marra, vice president of
engineering services at Hitachi Cable America. "The proven board design used
to communicate between Hitachi Cable's XFP module and the Aeluros Puma devices
can significantly shorten design cycles and reduce risk."
"Interoperability is a key concern for customers," said Don Bossi,
president
of JDS Uniphase's Transmission Products Group. "So we are pleased to see
Aeluros verify compatibility with our 850nm and 1310nm XFP modules. At the
same time, it is important to JDS Uniphase to work with companies such as
Aeluros that are as committed to fiber optics technology excellence as we are.
We are pleased to see industry enabling technology such as XFP continue to
grow."
"The XFI interoperability verification tests are one of the keys to
securing
XFP module operation on our customers' boards," said Kiyo Hiramoto, product
marketing manager at Opnext. "The interoperability tests between the Aeluros
Puma AEL1002 IC and the Opnext XFP module have proven error free operations
across 12" trace on standard FR-4 board with XFI mask compliances. Opnext XFP
modules build upon our leading-edge laser diode technology to leverage a
proven track record in high-performance optical component and packaging
technologies, and further reduce implementation risk."
"High bandwidth multimode fiber interconnects the vast majority of storage
networking equipment," said Warner Andrews, vice president of marketing at
Picolight. "Using the same fifty micron fiber, Picolight's 850nm XFP modules
delivered error-free operation over a 400 meter link when driven by the
Aeluros Puma XFI PHY device. This link exceeds the 300 meter Fibre Channel
specification and shows that 850nm XFP modules are well suited to the needs of
storage networking applications."
"The Puma device's low power consumption and reliable output signaling
capability for linecard applications provide important enablers for the XFP
form factor in transmission systems of up to 40 kilometers," said Kengo
Matsumoto, Next Generation Pluggable Transceiver project leader at Sumitomo
Electric. "Furthermore, the combined power of the Sumitomo XFP module and
Aeluros Puma SerDes device of only 2.5W will be a significant advantage in
ranges up to 10 km. The rapid bring-up of the Sumitomo XFP module & Aeluros
Puma device combination ensures that system manufacturers will have a fast
path to success."
"The XFP form factor can be applied to a wide range of potential solutions,
including implementation of links across low-cost copper cabling," said Bob
Atkinson, business development manager at Tyco Electronics. "The XFP Direct
Attach Pluggable Transceiver Module from Tyco Electronics provides a
successful integrated link with the Aeluros Puma AEL1002 device across 1m of
un-equalized copper cable or up to 20m of equalized copper cable for a lower
cost, lower power alternative to XFP optical links."
A variety of testing methodologies were used to complete this
interoperability, thus providing a range of environments and challenges. Each
solution was validated through the use of the Aeluros Puma AEL1002 Evaluation
Kit, an integrated evaluation and demonstration platform providing a 12" trace
across standard FR4 material, thereby exceeding the XFP worst-case channel
specification by 50%. The combined solution of the Aeluros Puma AEL1002 device
and each XFP module illustrated significant margin to the XFP specification
from a performance standpoint. Voltage, temperature, fiber optic link
distance, and setup topology conditions were also exercised in order to
validate robust interoperability in a system environment. Additional details
regarding these interoperability efforts are available in interoperability
reports from Aeluros and the various module vendors.
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