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DAILY NEWS AND INFORMATION
FOR THE GLOBAL GRID COMMUNITY / AUGUST 4, 2003; VOL. 2 NO. 31
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Breaking News -
Networking:
Broadcom Offers Groundbreaking
New Switch
Broadcom Corporation, a leading provider of silicon solutions enabling
broadband communications, has announced the Broadcom BCM5673, the industry's
first 10 Gigabit Ethernet (10GbE) multi-layer switch that delivers wire-speed
Layer 2 through Layer 7 switching and routing capabilities over cost-effective
10GBASE-CX4 copper medium (CX4). As the latest addition to Broadcom's field-
proven StrataXGS product family, this highly integrated single-chip device,
enables system manufacturers for the first time to build stackable 24- and 48-
port Gigabit Ethernet (GbE) switches with multiple 10GbE interfaces in a
compact 1U form factor (standard unit height of approximately 1.75
inches).
The rapid transition from Fast Ethernet to Gigabit Ethernet for desktop and
notebook computers has accelerated the need for GbE stacking switches in the
wiring closet. In addition, network administrators continue to deploy servers
with GbE in data centers. To meet the demand for this increase in cumulative
bandwidth, today's enterprise networks require affordable and reliable 10GbE
uplinks for data aggregation and routing at the core of the network. With the
new IEEE 802.3ae-compliant BCM5673 device, network administrators can now
deploy feature-rich and economical 10GbE systems into the enterprise.
The BCM5673 integrates a CX4-compatible 10GbE Attachment Unit Interface
(XAUI)
SerDes (serializer/deserializer) making it an ideal solution for compact 10GbE
stackable systems. Solutions prior to the BCM5673 required optical components
and complex subsystems, resulting in significantly higher costs with less
reliability. The CX4-compatible SerDes enables the transmission of 10GbE over
low cost, standard copper media as well as fiber. This allows equipment
manufacturers to build systems with 10GbE interfaces at a fraction of the cost
of current, expensive optical solutions.
The BCM5673's integrated architecture combines a packet buffer memory,
on-chip
address tables and high-performance SerDes in a single device, significantly
reducing the number of components necessary in a 10GbE switch. Competitive
10GbE silicon solutions usually require standalone SerDes, a minimum of four
external memory devices and a fabric interface chip, resulting in at least
seven components per 10GbE port. By integrating the functionality of multiple
chips into a single-chip solution, Broadcom's new BCM5673 device reduces
system manufacturing cost, board space and power requirements, thereby
allowing equipment manufacturers to build small form-factor 10GbE uplink
modules as well as high-density 10GbE switch systems.
The unique ContentAware network processing capabilities of the BCM5673
provide
Layer 2 through Layer 7 per packet intelligence. This extremely flexible on-
chip classification processor empowers network administrators to
simultaneously deploy voice, video and data in IPv4 and IPv6 networks.
Furthermore the device enables complex, content-based access control lists
(ACLs) for implementing security features, such as denial of service attack
blocking, intrusion detection and wireless authentication.
"Broadcom's BCM5673 delivers complete wire-speed, Layer 2 through Layer 7
support, and makes the deployment of affordable 10 Gigabit Ethernet in the
enterprise a reality," said Martin Lund, Senior Director of Broadcom's
Enterprise Switching LOB. "The BCM5673 marks the latest advancement in our
widely-adopted StrataXGS product family and underscores Broadcom's position as
a technology leader with the ability to continually provide feature-rich,
highly integrated products that advance the networking industry."
"Integrating CX4 technology is an important step in creating a
cost-effective,
single-chip answer for next-generation enterprise networking equipment," said
Dan Dove, principal engineer, HP ProCurve Networking. "HP believes that this
type of robust, standard copper-wire solution will help drive the adoption of
10 Gigabit Ethernet into the enterprise network by offering an alternative to
cost-prohibitive, optical-based products." Technical Information The BCM5673
is a dual-port switch, with a 10GbE port and a HiGig uplink port for complete
interoperability with other StrataXGS products, including high-density switch
fabrics and GbE multi-layer switches. The device supports line rate switching
and routing for all packet sizes, including jumbo frames. Offered in a 400-pin
PBGA package, the device utilizes 0.13-micron CMOS process technology and
yields a power consumption of less than 4W. The device features an integrated
CX4-compatible XAUI transceiver that allows for direct connection to copper
cables, Xenpak, XPAK and X2 modules without the need of additional
components.
In combination with Broadcom's BCM8703 transceiver, the BCM5673 also
supports
the increasingly popular XFP xmodules and provides system manufacturers the
flexibility in choosing a convenient and economical physical interface. The
BCM5673 reduces system development time and accelerates customer time- to-
market by leveraging customer software previously developed for the StrataXGS
common application programming interface (API). Broadcom also offers complete
software development kits (SDK) and reference designs for the BCM5673,
including software, schematics, layout files and related documentation.
Availability and Pricing Samples of the BCM5673 are currently available to
customers with production quantities expected by the end Q3 of 2003. Pricing
is available upon request.
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