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DAILY NEWS AND INFORMATION
FOR THE GLOBAL GRID COMMUNITY / JUNE 23, 2003: VOL. 2 NO. 25
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Systems/Enterprise:
BAE SYSTEMS SIGNS GRID
COLLABORATION AGREEMENT WITH ENTROPIA
Entropia Inc, a leading provider of PC grid computing solutions, has
announced
a strategic development collaboration with BAE SYSTEMS, a leading systems and
aerospace company. This relationship combines BAE SYSTEMS' global expertise in
engineering and mechanical design with Entropia's technological leadership in
PC grid computing to further the goal of unifying BAE SYSTEMS' compute
resources under a grid architecture umbrella.
Entropia's DCGrid, a powerful and cost-effective PC grid computing platform
that provides high performance computing capabilities by harnessing the unused
processing cycles of networks of existing Windows-based PCs, will be
integrated within the infrastructure at BAE SYSTEMS. BAE SYSTEMS intends to
use their PC grid as a research platform for their existing proprietary and
third party applications. Additional capabilities that will allow for
embedding DCGrid within their proprietary applications will be jointly
developed during this collaboration.
"We've employed grid methodologies for a while now but the addition of the
Entropia technology provides a professionally engineered solution that was
built for the desktop. DCGrid's open architecture facilitates interoperation,
using OGSA and Globus Toolkit 3.0, with our existing capabilities. Further,
DCGrid's application integration model will allow us to jointly develop
capabilities specific to the engineering and mechanical design sector," said
Alan Gould, grid project leader, BAE SYSTEMS Advanced Technology Centre.
"BAE SYSTEMS' diverse application requirements make them an ideal partner
to
further enhance the capabilities of Entropia's product family for the
engineering market sector," commented John Wark, president & CEO of Entropia.
"Given our mutually strategic objectives, BAE SYSTEMS will benefit directly
from a dedicated software development effort, while DCGrid is stress tested
under real world production conditions in the engineering arena."
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